APPLIED PLASTICS CO., INC.

APC lowers rejection rate just-in-time

A leading manufacturer of ion implantation equipment uses a metal clamp to hold thin silicon wafers during processing. The uncoated metal of the clamp was scratching the delicate wafer surface and depositing microscopic metal particles, resulting in a high reject rate. The high temperatures at which the wafers were laminated precluded the use of conventional paints.

APC researched a variety of different coatings until we located one with the correct properties. We discovered that TEFLON®-FEP would provide the most efficient surface qualities, and because it could be cured at low temperatures there was no threat of distortion to the clamp metal. This material not only answered the problem, but also provided a slight cushioning effect that further protected the delicate wafers from compression damage during lamination. Most important, APC was able to supply the coated clamp on a just-in-time basis.

Mandrels being grit-blasted with
aluminum oxide to prepare surface
for fusing of the coating. Certain
metals are coated with a phosphate
solution to obtain superior powder adhesion.

P.O. Box 128, 25-T Endicott St., Norwood, MA 02062
TEL: 781-762-1881  FAX: 781-769-3349

[A solution to every problem][APC is right on target][APC lowers rejection rate Just-In-Time] [APC gets right to the point] [A coating for every reason]
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